Configurable bus termination for multi-core/multi-package processor configurations

ABSTRACT

A multi-core/multi-package bus termination apparatus includes a configuration array and a plurality of drivers. The configuration array generates location/protocol signals that each direct one of the plurality of drivers on the bus to employ location-based bus termination or protocol-based bus termination. The plurality of drivers is coupled to the plurality of location/protocol signals, a plurality of location signals, a bus ownership signal, and a multi-package signal. Each of the plurality of drivers controls how one of a plurality of nodes is driven responsive to a first state of one of the plurality of location/protocol signals. Each has configurable multi-core/multi-package logic controls pull-up logic, first pull-down logic, and second pull-down logic according to location-based termination rules if the first state indicates the location-based termination, and controls the pull-up logic, the first pull-down logic, and the second pull-down logic according to protocol-based termination rules if the first state indicates the protocol-based termination.

This application is related to the following co-pending U.S. patentapplications Ser. Nos., each of which has a common assignee and commoninventors.

Ser. No. FILING DATE TITLE 12/423,135 Apr. 14, 2009 LOCATION-BASED BUSTERMINATION FOR MULTI-CORE PROCESSORS 12/423,142 Apr. 14, 2009LOCATION-BASED BUS TERMINATION FOR MULTI- CORE/MULTI-PACKAGE PROCESSORCONFIGURATIONS 12/423,147 Apr. 14, 2009 PROTOCOL-BASED BUS TERMINATIONFOR MULTI-CORE PROCESSORS

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates in general to the field of microelectronics, andmore particularly to a mechanism for enabling and sustaining amulti-processor environment on a bus that requires active control of bustermination impedances, where the multi-processor environment includesprocessor package substrates having multiple processor dies disposedthereon.

2. Description of the Related Art

Many present day bus architectures provide only for a point-to-point businterface between two devices such as a microprocessor and itscorresponding memory controller in order to support very fast incidentwave switching with a low output swing. In addition to providing onlyfor a point-to-point interface, the architectures also require that themicroprocessor (or other device) provide termination impedance controlcircuits within to dynamically adjust a termination impedance on thepoint-to-point bus, where the value of the impedance is generallyselected to match the characteristic impedance of the bus itself.

In many applications, the value of the impedance is communicated to thedevice by coupling a precision resistor to an I/O pin on the device.Accordingly, the device provides drivers on-die that are configured todrive the point-to-point bus at the selected impedance value and atvoltage levels in accordance with the bus specifications. These driversprovide for a properly terminated transmission line that supports theminimization of reflections, signal distortion, and other transmissionline effects.

And while the point-to-point bus is effective for the case where onlytwo devices communicate over the bus, the present inventors have notedfor certain application areas such as a multi-processor application,more than one device may be required. In these applications, perhaps oneto eight processors are required to interface in parallel to a memorycontroller over a bus as described above. In the future, it isanticipated that many more processors will be required to communicateover the same bus.

In U.S. Pat. No. 7,358,758, entitled APPARATUS AND METHOD FOR ENABLING AMULTI-PROCESSOR ENVIRONMENT ON A BUS, the present inventors addressedthe above-noted problem by disclosing techniques for enabling multipledevices to be interfaced together over a bus that requires dynamicimpedance controls. In one embodiment, an apparatus was provided forenabling a multi-device environment on a bus, where the bus requiresactive termination impedance control. The apparatus included a firstnode, configured to receive an indication that a corresponding device isat a physical end of the bus or that the corresponding device is aninternal device. The apparatus also included multi-processor logic;coupled to the first node, configured to control how a second node isdriven according to the indication, where the second node is coupled tothe bus. The multi-processor logic enables pull-up logic and pull-downlogic if the indication indicates that the corresponding device is atthe physical end of the bus. The multi-processor logic disables thepull-up logic and enables the pull-down logic if the indicationdesignates the corresponding device as an internal device. The pull-downlogic drives the second node to a prescribed low voltage levelregardless of whether the pull-up logic is enabled or disabled.

With the advent of so-called multi-core architectures, the presentinventors have further noted a need in the art to address the need foractive termination impedance control for a plurality of processor coresthat are coupled together over a bus to a memory controller or otherdevice, where the processor cores are each configured as a singleprocessor die, and where two or more of these single processor dies aredisposed on a single substrate within a multi-core processor packagethat is coupled to the bus. For purposes of the present disclosure, theterm “multi-core processor” is defined to mean two or more singleprocessor dies which are disposed on a single substrate. The singlesubstrate may be multiple layers of interconnecting signals and otherdevices that provide for packaging of the multi-core processor andconnectivity to the bus and other system-related signals.

The present inventors have moreover observed a need in the art toaddress the need for active termination impedance control for aplurality of multi-core processor packages, as described above, that arecoupled together over a bus to a memory controller or other device.

But conventional bus architectures are limited because they requireactive impedance control without provisions for the use of multi-coreprocessors. For example, when one processor core drives the busdescribed above, it would see an effective termination impedance that isdeveloped by the parallel termination impedances of the other processorcores on the bus in addition to the other bus devices and, accordingly,driving I/O signals into this effective pull-up termination impedancewould result in high frequency noise, reflections, ringing, timingdisplacements, and other disadvantages.

Consequently, the present inventors have observed that it is highlydesirable to provide for inter-operation of a variable number of devicesover a bus that requires active impedance control, where those devicesinclude multi-core processors.

In addition, the present inventors have noted a need in the art forenabling a multi-core/multi-package environment over an activelycontrolled bus.

SUMMARY OF THE INVENTION

The present invention, among other applications, is directed to solvingthe above-noted problems and addresses other problems, disadvantages,and limitations of the prior art. The present invention provides asuperior technique for enabling multi-core devices to be interfacedtogether over a bus that requires dynamic impedance controls. In oneembodiment, an apparatus for enabling a multi-core/multi-packageenvironment on a bus is provided, where the bus requires activetermination impedance control. The apparatus includes a configurationarray and a corresponding plurality of drivers. The configuration array,disposed within the processor core and configured to generate aplurality of location/protocol signals that each direct one of thecorresponding plurality of drivers on the bus to employ location-basedbus termination or protocol-based bus termination, where the processorcore is disposed on a multi-core substrate. The corresponding pluralityof drivers is coupled to the plurality of location/protocol signals, aplurality of location signals, a bus ownership signal, and amulti-package signal. Each of the corresponding plurality of drivers isconfigured to control how one of a corresponding plurality of nodes isdriven responsive to a first state of a corresponding one of theplurality of location/protocol signals. Each of the correspondingplurality of drivers has configurable multi-core/multi-package logicthat is configured control pull-up logic, first pull-down logic, andsecond pull-down logic according to location-based termination rules ifthe first state indicates the location-based termination, and isconfigured control the pull-up logic, the first pull-down logic, and thesecond pull-down logic according to protocol-based termination rules ifthe first state indicates the protocol-based termination.

One aspect of the present invention contemplates a microprocessorproviding for a multi-core/multi-package environment on a bus, where thebus requires active termination impedance control. The microprocessorincludes configurable multi-core/multi-package logic and a configurationarray. The configurable multi-core/multi-package logic is disposedwithin one of a plurality of drivers, and is coupled to one of acorresponding plurality of location/protocol signals, one of acorresponding plurality of location signals, a bus ownership signal, anda multi-package signal, and is configured to control pull-up logic,first pull-down logic, and second pull-down logic according to a firststate of the one of a corresponding plurality of location/protocolsignals. The configuration array is disposed within a processor core andis coupled to the configurable multi-core/multi-package logic, and isconfigured to generate the corresponding plurality of location/protocolsignals that each direct a corresponding one of the plurality of driversto employ location-based bus termination rules or protocol-based bustermination rules, where the processor core is disposed on a multi-coresubstrate.

Another aspect of the present invention comprehends a method forenabling a multi-core/multi-package environment on a bus, where the busrequires active termination impedance control. The method includes, viaa configuration array disposed within a processor core, generating afirst indication designating how one of a plurality of nodes to bedriven, wherein the processor core is disposed on a multi-coresubstrate; and via configurable multi-core logic disposed within adriver, controlling how the one of a plurality of nodes is driven. Thecontrolling includes, if the first indication designates the one of theplurality of nodes is to be driven according to location-basedtermination rules, enabling pull-up logic, first pull-down logic, andsecond pull-down logic in accordance with second state of one of aplurality of location signals and the third state of a multi-packagesignal; and if the first indication designates the one of the pluralityof nodes is to be driven according to protocol-based termination rules,enabling the pull-up logic, first pull-down logic, and second pull-downlogic in accordance with the fourth state of a bus ownership signal.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other objects, features, and advantages of the presentinvention will become better understood with regard to the followingdescription, and accompanying drawings where:

FIG. 1 is a block diagram illustrating a present day point-to-point busthat requires active control of bus termination impedances;

FIG. 2 is a block diagram depicting a present day multi-processorenvironment that is enabled over a bus like that of FIG. 1;

FIG. 3 is a block diagram featuring a present day multi-processorenvironment apparatus within a microprocessor;

FIG. 4 is a block diagram showing an exemplary multi-core processordisposed on a single substrate;

FIG. 5 is a block diagram illustrating a location-based multi-core bustermination apparatus according to the present invention;

FIG. 6 is a block diagram depicting a location-basedmulti-core/multi-package bus termination apparatus according to thepresent invention;

FIG. 7 is a block diagram featuring a protocol-based multi-core bustermination apparatus according to the present invention which may beemployed in a configuration having one or more multi-core packagescoupled to a bus; and

FIG. 8 is a block diagram showing a configurable multi-core bustermination mechanism according to the present invention.

DETAILED DESCRIPTION

The following description is presented to enable one of ordinary skillin the art to make and use the present invention as provided within thecontext of a particular application and its requirements. Variousmodifications to the preferred embodiment will, however, be apparent toone skilled in the art, and the general principles defined herein may beapplied to other embodiments. Therefore, the present invention is notintended to be limited to the particular embodiments shown and describedherein, but is to be accorded the widest scope consistent with theprinciples and novel features herein disclosed.

In view of the above background discussion on bus interfaces andassociated techniques employed within present day integrated circuitsfor transfer of data between devices, a discussion of the problemsassociated with actively terminated buses will be presented withreference to FIGS. 1-3. Following this, a discussion of the presentinvention will be presented with reference to FIGS. 5-7. The presentinvention overcomes the limitations of present day bus interfacetechniques by providing apparatus and methods for enabling multiplepackages having multiple processor cores to be interfaced over a busrequiring active termination impedance control, while at the same timepreserving the transmission line characteristics required.

Turning to FIG. 1, a block diagram 100 is presented illustrating apresent day point-to-point bus 120, such as is provided for in manystate-of-the-art microprocessor architectures. The block diagram depictsa present day processor 101 that is coupled to a memory controller 110via the point-to-point bus 120. The memory controller 110 is depictedfor illustrative purposes to teach limitations associated with thestate-of-the-art and it is noted that any type of device (e.g., busagent, memory hub, chipset, etc.) may be employed. A memory controller110 is used in this discussion because it is representative of the typeof device which is interfaced to a present day processor 101 over thepoint-to-point bus 120.

The processor 101 includes pad control logic 102 that receives a signalOUT1. The pad control logic 102 is coupled to pull-up logic 103 via apull-up enable signal PUEN1 and to pull-down logic 105 via a pull-downenable signal PDEN1. The pull-up logic 103 and pull-down logic 105 arecoupled together to form a pad node 104 developing a bidirectional padsignal PAD1. A resistor R1 is also coupled to the processor 101 at anode 106. In a present day processor 101, the node 106 typically iscoupled to a pin (not shown) on a device package (not shown) of theprocessor to allow for ease of mounting to a motherboard orsubstantially similar form of packaging.

The memory controller 110 also has pad control logic 112 that receives asignal OUT2. The pad control logic 112 is coupled to pull-up logic 113via a pull-up enable signal PUEN2 and to pull-down logic 115 via apull-down enable signal PDEN2. The pull-up logic 113 and pull-down logic115 are also coupled together to form a pad node 114 developing abidirectional pad signal PADM. In like manner, a resistor R2 is coupledto the memory controller 111 at a node 116, which, like the processor101, is typically coupled to a pin on a device package into which thememory controller 110 is encased.

The processor 101 interfaces to the memory controller 110 via thepoint-to-point bus 120 having a characteristic impedance Z₀. Theinterface specifically depicts signal PAD1 coupled to signal PADM (andtheir respective nodes 104, 114) over a single signal routing mechanism120, shown as a transmission line 120 in the block diagram 100, butwhich typically comprises a trace 120 on a motherboard. For claritypurposes, nodes PAD1 and PADM are shown coupled together via the singletrace 120. One skilled in the art will appreciate, however, that apresent day bus 120 comprises many such signals substantially similar tothose 104, 114 shown.

For certain application areas, including laptop, mobile, and networkingapplications, more than one processor 101 may not be required in a givensystem configuration. Consequently, to provide for very fast system busspeeds on a present day low voltage bus 120, system bus architectures atfirst changed from multi-processor environments to uniprocessorenvironments. The uniprocessor environment, as shown in the blockdiagram 100, includes active on-die (i.e., “on-chip”) terminationimpedance control features. Whereas former multi-point architecturesprovided for termination of a bus signal external to devices on a bus,today's bus architectures require that bus termination impedances beprovided for on-die and that such termination impedances be dynamicallyadjusted such that they are equal to or proportional to an externallyprovided precision resistance, depicted by resistors R1 and R2, that islocated on a motherboard or substantially similar interconnectionmechanism. This externally provided precision resistance R1, R2 isindicative of the transmission line characteristic impedance Z₀exhibited by a trace 120 or signal path 120 on the motherboard whichinterconnects the first node (i.e., pin) PAD1 of a processor 101 to thesecond node PADM 114 of the memory controller 110.

Conventional bus protocols prescribe a required bus terminationimpedance. Typically, this impedance is communicated to the processor101 and the memory controller 110, respectively, via the externalresistors R1 and R2. In most cases, these two resistors R1, R2 are equalin value, but the values may differ in some configurations. A typicalvalue for R1 and R2 is 27.5 ohms which indicates a 55 ohm characteristicimpedance Z₀ of the interconnecting transmission lines 120 that make upthe bus. Although R1 and R2 are shown in the block diagram 100 coupledto a ground reference, one skilled in the art will appreciate that thevalue of the voltage reference (e.g., VSS) to which the resistors R1-R2are coupled may vary in accordance with the other voltages (not shown)that are provided to the processor 101 and memory controller 111 from asystem power supply.

A properly terminated transmission line 120 that has no reflections hasa parallel termination impedance at the far end of the signal trace 120that is equal to the characteristic impedance Z₀ of the signal trace120. Thus, in order to provide for proper terminations, the processor101 and the memory controller 111 are required to dynamically controltheir respective impedances at nodes 104 and 114 as noted above suchthat the impedances are either equal to or proportional to R1 and R2, asprescribed by the specific bus protocol that governs the interface.

This dynamic control is typically accomplished via the pull-up logic103, 113 and pull-down logic 105, 115 as shown. In one case, a signal onnode PAD1 is active, or asserted, when it is pulled (“driven”) to aspecified low voltage level (not shown) through the pull-down logic 105.Accordingly, when PAD1 is asserted, a typical point-to-point busprotocol dictates that the pull-up logic 103 must be turned off. WhenPAD1 is not asserted, the pull-up logic 103 must be on, thus drivingPAD1 up to a high voltage level (not shown). In addition, the typicalprotocol prescribes that only one device 101, 110—either the processor101 or the memory controller 110—can be driving the bus 120 (i.e.,pulling down the voltage on the bus 120 via pull-down logic 105, 115) atany given point in time. It is further required that the pull-up logic103, 113 on both the processor 101 and the memory controller 110 bedynamically controlled to vary corresponding pull-up impedances suchthat they match the characteristic impedance Z₀ of the signal trace 120on the motherboard (or other mechanism) that connects nodes PAD1 andPADM. Thus, when one of the devices 101, 111 drives the bus 120, andturns off its corresponding pull-up logic 103, 113, the driving device'spull-down logic 105, 115 generates a low going transition on the bus120, that propagates down the transmission line environment of thesignal trace 120 which is terminated at the far end by the otherdevice's pull-up logic 113, 103.

The pull-down logic 105, 115 is configured to drive a signal on the bus120 to the specified low voltage level. Accordingly, since thetermination impedance developed by the other device 111, 101 at the farend of the bus 120 matches the characteristic impedance Z₀,disadvantageous transmission line effects such as high frequency noise,ringing, reflections, etc., are precluded. In a typical embodimenthaving a 55-ohm characteristic impedance Z₀, the pull-down logic 105,115 is dynamically controlled to exhibit a 27.5 ohm impedance, thusdriving a high voltage level of VH to a low voltage level VL that isapproximately one-third of VH. This allows the pull-down logic 105, 115to develop a low voltage level VL that is sufficiently immune to noiseon the bus 120. The manner in which the pull-down logic 105, 115dynamically controls the impedance is beyond the scope of thisapplication.

To summarize, on a point-to-point bus 120, when the bus 120 is not beingdriven low by a device 101, 110, then the device's pull-up logic 103,113 must drive its corresponding node PAD1, PADM to a high voltage levelVH according to a prescribed bus termination impedance. When a nodePAD1, PADM on the bus 120 is driven low by a given device 101, 110, thegiven device 101, 110 must turn off its pull-up logic 103, 113 and turnon its pull-down logic 105, 115 to present a prescribed pull-downimpedance. By doing so, since the opposite device's pull-up logic 113,103 is on, the transmission line 120 is properly terminated so thatthere are no reflections and proper bus voltage levels VH, VL aregenerated.

Accordingly, when internal core signals OUT1, OUT2 are not asserted, padcontrol logic 102, 112 in either the processor 101 or memory controller110 asserts pull-up logic enable signals PUEN1, PUEN2 that respectivelyturn on pull-up logic 103, 113 in both devices 101, 110, where thepull-up logic 103, 113 is also dynamically controlled to exhibit atermination impedance that provides for proper transmission of signalsover the bus 120. In addition, the pad control logic 102, 112 alsodeasserts pull-down logic enable signals PDEN1, PDEN2, thus turning offrespective pull-down logic 105, 115 in both devices 101, 110.

When core signal OUT1 is asserted, the pad control logic 102 in theprocessor 101 deasserts PUEN1, turning off the pull-up logic 103, andasserts PDEN1, turning on the pull-down logic 105, where the pull-downlogic is dynamically controlled to exhibit an impedance when drivingnode PAD1 104 that comports with the characteristic impedance Z₀ such aproper bus voltage level VL is achieved. Likewise, when core signal OUT2is asserted, the pad control logic 112 in the memory controller 110deasserts PUEN1, turning off its pull-up logic 113, and asserts PDEN1,turning on its the pull-down logic 115, thus propagating a correctsignal level into the transmission line environment of the signal trace120 having characteristic impedance Z₀.

The conventional point-to-point bus architecture is indeed effectivefrom a performance standpoint for many applications, however, in U.S.Pat. No. 7,358,758 the present inventors noted numerous otherapplication areas that benefit from the employment of multipleprocessors, particularly when a memory controller (or substantiallyequivalent bus interface device) with corresponding interfacecapabilities is provided as part of a multi-processor systemconfiguration. Accordingly, the patent disclosed an apparatus and methodto enable multiple processors to interoperate over a bus that requiredactive impedance control.

Referring to FIG. 2, a block diagram is presented featuring amulti-processor environment 200 that is enabled over a bus 220 over abus like that of FIG. 1, and as is disclosed in U.S. Pat. No. 7,358,758.The block diagram shows a plurality of processors 201 withinterconnected nodes 202 developing respective bus signals PAD1-PADN.Hereinafter, the signal designators PAD1-PADN will be used to also referto a specific one of the nodes 202. The plurality of processors 201 arealso interfaced to a memory controller 211 (or substantially similardevice 211) with bus interface node 212 that develops a bus interfacesignal PADM, substantially similar to that shown in FIG. 1. In oneembodiment, a variable number of processors 201 are enabled forinter-operation with the memory controller 211 over the bus 220. In aspecific embodiment, up to four processors 201 are enabled forinter-operation. Each of the processors 201 and the memory controller211 receive a prescribed termination impedance externally via resistorsR1, R2 or like manners of indicating or specifying bus terminationimpedance, such as has been described previously herein. In oneembodiment, R1 and R2 specify a 55 ohm termination impedance and a 27.5ohm pull down impedance for a uniprocessor bus configuration. Inaddition, each of the processors 201 according to the present inventionincludes a node 204 for receiving a multi-processor signal MP that isemployed to configure a multiprocessing environment. In one embodiment,the multi-processor node 204 comprises a pin 204 on a microprocessorpackage, where the pin is not otherwise employed in a systemconfiguration according to the present invention. In this embodiment,signal MP is coupled to the multi-processor pin 204. Alternativeembodiments are also contemplated for coupling the multi-processor node204 to a signal MP to configure the multi-processing environment.

To control the termination impedance of the bus 220, the processor 201that is physically at the end of the transmission line 220 opposite thememory controller 211 has its MP node 204 tied to a first referencesignal MP whose value indicates that the processor 201 is at the end ofthe transmission line 220 opposite the memory controller 211. In theexample shown in FIG. 2, PROCESSOR 1 201 is at the physical end of thebus 220 opposite the memory controller 211 and thus, its correspondingMP node 204 is coupled to the first reference signal MP. In oneembodiment, as shown in the block diagram, the value of the firstreference signal is ground, or common reference value (e.g., the VSSvoltage). Other values of the first reference signal are contemplated aswell. And to indicate that the processors 201 between PROCESSOR 1 201and the memory controller 211 are internal to the bus 220, that is,PROCESSOR 2 201 through PROCESSOR N 201, their corresponding MP nodes204 are tied to second reference signals whose values indicate that theprocessors 201 are internal to the bus 220. In one embodiment the valueof the second reference signals is VDD. Alternative embodiments for thesecond reference voltage comprehends substantially similar referencevoltages provided for I/O devices on the bus 220. Other embodiments forindicating the physical location of processors on the bus arecontemplated as well, such as multiple-pin encoding, writing internalregisters via a JTAG bus (not shown), programming of machine specificregisters, etc.

Because PROCESSOR 1 201 is at the far end of the bus 220, it isconfigured (via tying node MP 204 to ground) to dynamically control thebus pull-up termination impedance and to drive its corresponding PAD1node 202 in substantially the same manner as is described above withreference to the processor 101 of FIG. 1. Also, as described withreference to FIG. 1, the memory controller 211 controls the bus pull-uptermination impedance at its end of the bus 220 and drives itscorresponding bus node PADM 212 in like manner. PROCESSOR 2201-PROCESSOR N 201 (i.e., internal processors 201), however, drive thebus 220 differently according to the present invention because they arephysically between PROCESSOR 1 201 and the memory controller 211.According to the present invention, internal processors PROCESSOR 2201-PROCESSOR N 201 are configured via their correspondingmulti-processor nodes MP 204 to turn off their pull-up logic (not shown)at all times so that the prescribed termination impedance of the bus 220is maintained by PROCESSOR 1 201 and the memory controller 211. Inaddition, when one of the internal processors PROCESSOR 2 201-PROCESSORN 201 drives to its respective bus node 202 to a low voltage value,alternative pull-down logic (not shown) therein is employed to drive thenode 202 to a proper low voltage level in view of having to drive intotwo signal traces, each of characteristic impedance Z₀, with aneffective impedance seen by a corresponding driver of Z₀/2. Thus, thealternative pull-down logic must be strong enough to drive nodesPAD2-PADN 202 to the prescribed low voltage level when driving into thetwo signal traces as opposed to one signal path.

Now turning to FIG. 3, a block diagram 300 is presented showingmulti-processor environment apparatus that is included in each of theprocessors PROCESSOR 1-PROCESSOR N 201 of FIG. 2, as is described inU.S. Pat. No. 7,358,758. The block diagram 300 depicts a processor 301that is coupled to a bus 320, or transmission line 320, having acharacteristic impedance of Z₀, as is described above. Themicroprocessor 301 includes pad control logic 304, first pull-down logic307, and pull-up logic 305, including control signals OUT1, PUEN1,PDEN1, that operate as described above for like-named signals withreference to FIG. 1. The pad control logic 304, first pull-down logic307, and pull-up logic 307 each comprise logic, circuits, devices, ormicrocode (i.e., micro instructions or native instructions), or acombination of logic, circuits, devices, or microcode, or equivalentelements that are employed to perform functions and operations asdescribed herein. The elements employed to perform these functions andoperations may be shared with other circuits, microcode, etc., that areemployed to perform other functions within the processor 301. Accordingto the scope of the present application, microcode is a term employed torefer to a plurality of micro instructions. A micro instruction (alsoreferred to as a native instruction) is an instruction at the level thata unit executes. For example, micro instructions are directly executedby a reduced instruction set computer (RISC) microprocessor. For acomplex instruction set computer (CISC) microprocessor such as anx86-compatible microprocessor, x86 instructions are translated intoassociated micro instructions, and the associated micro instructions aredirectly executed by a unit or units within the CISC microprocessor.

In addition, the apparatus includes multi-processor (“MP”) logic 303 andsecond pull-down logic 308. A signal MP is coupled to the MP logic 303and to a multiprocessor node P 302. As noted above, the presentinvention contemplates a number of embodiments for establishing a signalMP on the reference node P 302, one of which is shown in the blockdiagram 300. The block diagram 300 depicts node P 302 as a pin 302 onthe microprocessor 301 and the value of MP is established by couplingnode P 302 to a first or second reference voltage (not shown) as isdescribe above with reference to FIG. 2. The MP logic 303 senses thestate of node P 302 (and thus, the value of signal MP as shown in thediagram 300) to determine if it is at the far end of the bus 320 or ifit is internal to the bus 320. If the processor 301 is at the far end,then the MP logic 303 asserts signals ENPD1 and ENPU, that enableoperation of the pull-up logic 305 and the first pull-down logic 307, asdescribed with reference to FIGS. 1 and 2. Signal ENPD2 is deasserted,thus disabling operation of the second pull-down logic 308. A pad node306 developing signal PAD and the bus termination impedance are thuscontrolled via the pull-up logic 305 and the first pull-down logic 307as is required over a uniprocessor point-to-point environment. Thisconfiguration at the far end of the transmission line 320 provides forthe actively controlled termination impedance that precludes ringing,etc., over the bus 320. The second pull-down logic 308 comprises logic,circuits, devices, or microcode (i.e., micro instructions or nativeinstructions), or a combination of logic, circuits, devices, ormicrocode, or equivalent elements that are employed to perform functionsand operations as described herein. The elements employed to performthese functions and operations may be shared with other circuits,microcode, etc., that are employed to perform other functions within theprocessor 301.

For internal processors, signal ENPU is deasserted by the MP logic 303,signal ENPD2 is asserted, and signal (i.e., node) PAD 306 is thuscontrolled via the first and second pull-down logic 307-308, operatingin parallel. The pull-up logic 305 is disabled by the state of signalPUEN1 in an internal configuration, as indicated by the value of signalMP on node P 302. In one embodiment, the first and second pull-downlogic 307-308 are configured to pull PAD 306 to a specified low voltagelevel VL when driving into two signal traces (“paths”), each ofcharacteristic impedance Z₀. For illustrative purposes, an additionalsignal trace on the bus 320 is shown with dotted line connection to node306, which corresponds to an internal processor configuration. In analternative embodiment, the second pull-down logic 308 exhibits astrength that is different from that of the first pull-down logic 307,and the two pull-down logics 307-308 operate in parallel to achieveoptimum pull down of PAD to the proper low voltage level VL.

Notwithstanding the advantages afforded by the configurations describedwith reference to FIGS. 2-3, the present inventors have observed thatwith the advent of so-called multi-core architectures, it is desirableto address the need for active termination impedance control forconfigurations having a plurality of processor cores that are coupledtogether over a bus to a memory controller or other device, where theprocessor cores are each configured as a single processor die, and wheretwo or more of these single processor dies are disposed on a singlesubstrate within a multi-core processor package that is coupled to thebus. To address this need, the present invention will now be discussedwith reference to FIGS. 4-8.

Turning to FIG. 4, a block diagram is presented showing an exemplarymulti-core processor 400 disposed on a single substrate 401. Themulti-core processor 400 includes two processor cores 402, CORE A andCORE B, each of which is disposed on the substrate 401. The substrate401 may, in one embodiment, be configured as a ball grid array formingpart of an overall package for the multi-core processor 400, which ismounted to a motherboard (not shown) or system board (not shown) as partof a system configuration. Other embodiments for coupling the multi-coreprocessor 400 to a system configuration are contemplated as well.

The substrate 401 typically has multiple layers due to the fact that apresent day processor core 402 comprises hundreds of connection points(or “pins”) which must be routed to matching signals on the motherboardor to other processor dies mounted to the substrate 401. These pins aregenerally on the face of the substrate opposite to the face upon whichthe processor cores 402 are mounted. Similarly, the layers of thesubstrate 401 include hundreds of interconnecting traces 407-414 thatare provided to route particular signals to specific pins on each of theprocessor cores 402 and include hundreds of vias 403-406 which providefor interconnection of traces 408-414 between layers of the substrate401.

For purposes of teaching the present invention, the multi-core processor400 is shown to include only two processor cores 402 which share foursignals that are coupled to the four vias 403-406, however, as oneskilled in the art will appreciate, present day multi-core architecturescan include up to eight processor cores 402 disposed on a substrate 401,with future predications leading to up to 16 processor cores 402.Additional numbers of cores 402 are comprehended by the presentinvention as well. For clarity, the traces 407-414 and vias 403-406 aredepicted on a top layer of the substrate 401 and outside of the physicalboundaries of each of the processor cores 402, however, one skilled inthe art will also appreciate that it is normal to configure traces407-414 on internal layers of the substrate 401.

At via 403, a first signal is routed over trace 407 to a first pin onCORE A 402, and the same first signal is routed over trace 409 to acorresponding first pin on CORE B 402. At via 404, a second signal isrouted over trace 408 to a second pin on CORE A 402, and the same secondsignal is routed over trace 410 to a corresponding second pin on CORE B402. From a transmission line standpoint then, with respect to the firstand second signals CORE B 402 is at the end of the transmission line andCORE A 402 is internal to the transmission line, for traces 409 and 410are physically longer than traces 407 and 408.

On the other hand, at via 405, a third signal is routed over trace 411to a third pin on CORE B 402, and the same third signal is routed overtrace 413 to a corresponding third pin on CORE A 402. At via 406, afourth signal is routed over trace 412 to a fourth pin on CORE B 402,and the same fourth signal is routed over trace 414 to a correspondingfourth pin on CORE B 402. And from a transmission line standpoint, withrespect to the third and fourth signals CORE A 402 is at the end of thetransmission line and CORE B 402 is internal to the transmission line,for traces 413 and 414 are physically longer than traces 411 and 412.

Consequently, the present inventors have noted that interfacing amulti-core processor 400 to a system bus is problematic in that thephysical mounting point of each of the cores 402 cannot be employed asan indication of whether they are internal to the bus or at the end ofthe bus. From the example of FIG. 4, it is clear that transmission linetopology must be determined on a signal-by-signal basis. That is, forevery signal in a multi-core processor configuration that is bussed, thetransmission line location (i.e., internal or at the end) is a functionof the physical length of the traces 407-414 that route the signalsthrough the substrate 401 to each of the processor cores 402. Such atopology is exacerbated when additional cores 402 are added to thesubstrate 401, however, one skilled in the art will appreciate that foreach signal that is coupled, one of the cores 402 can be designated asthe end of the transmission line because the sum of the physical lengthsof the trace 407-414 that couple that signal from the motherboardconnection point to the core 402 at the end of the transmission line islonger that the sum of the lengths of the traces coupling that signalfrom the motherboard connection point to any of the remaining cores 402

Thus, the present invention is provided to address how driver circuitrywithin each of the cores 402 is to function in order to comport withrequirements of bus protocol while at the same time providing forminimization of transmission line effects as described above.Embodiments of the present invention will now be presented withreference to FIGS. 5-8 which address, respectively, 1) a location-basedtechnique for performing active bus termination for a single multi-coreprocessor 400 coupled to a bus, 2) a location-based technique forperforming active bus termination for two or more multi-core processors400 coupled to a bus, 3) a protocol-based technique for performingactive bus termination for one or more multi-core processors 400 coupledto a bus, and 4) a configurable active bus termination technique for oneor more multi-core processors 400 coupled to a bus.

Referring to FIG. 5, a block diagram 500 is presented illustrating alocation-based multi-core bus termination apparatus according to thepresent invention. The apparatus may be employed when a singlemulti-core processor (not shown), such as the multi-core processor 400of FIG. 4, is coupled to a plurality of bussed signals disposed on amotherboard or like device. The block diagram 500 depicts one of theprocessor cores 501 that is coupled to a substrate (not shown) for themulti-core processor. The processor core 501, in one embodiment, is anx86-compatible microprocessor core, although other processorarchitectures are contemplated. The core 501 includes a plurality ofsubstantially identical drivers 511, denoted as DRIVER 1-DRIVER N. Inaddition, the core 501 has a location array 510 developing acorresponding plurality of location signals SIGLOC 1-SIGLOC N, each ofwhich is coupled to a corresponding one of the drivers 511. The locationarray 510 comprises logic, circuits, devices, or microcode (i.e., microinstructions or native instructions), or a combination of logic,circuits, devices, or microcode, or equivalent elements that areemployed to perform functions and operations as described herein. Theelements employed to perform these functions and operations may beshared with other circuits, microcode, etc., that are employed toperform other functions within the processor core 501.

The block diagram 500 depicts one of the drivers 511 DRIVER 1 developinga bidirectional signal PAD1 that is coupled to a bus 520, ortransmission line 520, having a characteristic impedance of Z₀, as isdescribed above. Although not shown in FIG. 5, it is noted that each ofthe drivers 511 develop respective bidirectional signals, each of whichis coupled to a respective bus. For purposes of this disclosure, a busmay comprise a group or groups of signals, one of which is exemplifiedby signal PAD1, where the group or groups are transmitted together or insome known sequential order according to a specified protocol. Forinstance, a 64-bit data bus, a 32-bit address bus, and a correspondingcontrol bus, are quite common to present day processing systemconfigurations, and although the protocols for synchronizingtransmission of data/address/control information over these bussesdiffer according to processor architecture, these protocols are wellknown and understood by those skilled in the art.

Yet, as was noted above in the discussion with reference to FIG. 4,whether a particular signal (e.g., PAD1) is internal to the bus or atthe end of the bus is determined based upon the total trace length thatcouples each of the particular signal from a motherboard connectionpoint through a substrate and to the processor core 501. Thus, signalPAD 1 may be designated as an internal bus signal while another signal(not shown) developed by one of the other drivers 511 may be designatedas being at the end of the bus. In fact, it is entirely expected thatnormally grouped signals such as those within, say, a 64-bit data buswould not have the same core 501 designated as the bus endpoint. Thatis, each of the signals within the group would have a correspondingprocessor core 501 that is the designated end of the transmission linebased upon routing of the signals over the substrate.

Each of the drivers 511 are substantially identical with respect to thepresent invention, thus DRIVER 1 511 will be described in detail below.DRIVER 1 includes pad control logic 504, first pull-down logic 507,second pull-down logic 508, and pull-up logic 505, including controlsignals OUT1, PUEN1, PDEN1 that operate as described above forlike-named elements as are described above with reference to FIG. 3. Thepad control logic 504, first pull-down logic 507, second pull-down logic508, and pull-up logic 507 each comprise logic, circuits, devices, ormicrocode (i.e., micro instructions or native instructions), or acombination of logic, circuits, devices, or microcode, or equivalentelements that are employed to perform functions and operations asdescribed herein. The elements employed to perform these functions andoperations may be shared with other circuits, microcode, etc., that areemployed to perform other functions within the processor core 501.

In contrast to FIG. 3, driver 511 includes location-based multi-core(“LMC”) logic 503. A corresponding location signal SIGLOC 1 is coupledto the LMC logic 503 and to the location array 510. In one embodiment,the location array 510 comprises a programmable fuse array 510 that isdisposed within the core 501 and which is programmed during fabricationof the processor core 501 by any of several well-known techniques. Inanother embodiment, the location array 510 comprises a machine specificregister that is programmable via the execution of special instructions(i.e., microcode) during reset of the core 501.

The value of signal SIGLOC 1 indicates whether signal PAD1 is at the endof the bus or internal to the bus. In one embodiment, if SIGLOC 1 isasserted, then it is indicated that PAD1 is at the end of the bus. TheLMC logic 503 senses the state of SIGLOC 1 to determine if PAD1 is atthe far end of the bus 520 or if it is internal to the bus 520. If PAD1is at the far end, then the LMC logic 503 asserts signals ENPD1 andENPU, that enable operation of the pull-up logic 305 and the firstpull-down logic 507, as described with reference to FIGS. 1 and 2.Signal ENPD2 is deasserted, thus disabling operation of the secondpull-down logic 508. A pad node 506 developing signal PAD1 and the bustermination impedance are thus controlled via the pull-up logic 505 andthe first pull-down logic 507 as is required by bus protocol. Thisconfiguration at the far end of the transmission line 520 provides forthe actively controlled termination impedance that precludes highfrequency noise, ringing, etc., over the bus 520.

For internal processors, signal ENPU is deasserted by the LMC logic 503,signal ENPD2 is asserted, and signal PAD1 is thus controlled via thefirst and second pull-down logic 507-508, operating in parallel. Thepull-up logic 505 is disabled by the state of signal PUEN1 in aninternal configuration, as indicated by the value of signal SIGLOC 1. Inone embodiment, the first and second pull-down logic 507-508 areconfigured to pull PAD 506 to a specified low voltage level VL whendriving into two signal traces (“paths”), each of characteristicimpedance Z₀. For illustrative purposes, an additional signal trace onthe bus 520 is shown with dotted line connection to node 306, whichcorresponds to an internal processor configuration. In an alternativeembodiment, the second pull-down logic 508 exhibits a strength that isdifferent from that of the first pull-down logic 507, and the twopull-down logics 507-508 operate in parallel to achieve optimum pulldown of PAD1 to the proper low voltage level VL.

The embodiment discussed with reference to FIG. 5 is sufficient toprovide for minimization of transmission line effects corresponding to asingle multi-core processor configuration. For configurations thatconsist of two or more multi-core processors, the embodiment of FIG. 6is provided.

FIG. 6 is a block diagram 600 is presented depicting a location-basedmulti-core/multi-package bus termination apparatus according to thepresent invention. The apparatus may be employed when two or moremulti-core processors (not shown), such as the multi-core processor 400of FIG. 4, are coupled to a plurality of bussed signals disposed on amotherboard (not shown) or like device in a configuration like thatshown in FIG. 2. The block diagram 600 depicts one of the processorcores 601 that is coupled to a substrate (not shown) for the multi-coreprocessor. The elements of core 601 are substantially the same andoperate in substantially the same manner as those like numbered elementsof FIG. 5, where a “6” is substituted for the hundreds digit. To providefor proper bus terminations corresponding to two or more multi-coreprocessors, location-based multi-package logic 613 is provided in placeof the LMC logic 503 of FIG. 5. In addition, the processor core 601includes a signal MPK that is coupled to the LMCP logic 613 and to amulti-package node P 602. As noted earlier, the present inventioncontemplates a number of embodiments for establishing signal MPK on thereference node P 602, one of which is shown in the block diagram 600.The block diagram 600 depicts node P 602 as a pin 302 on the processorcore 601 and the value of MPK is established by coupling node P 602 to afirst or second reference voltage (not shown) as is described above withreference to FIG. 2. The LMCP logic 613 senses the state of node P 602(and thus, the value of signal MPK as shown in the diagram 600) todetermine if a package (i.e., the substrate) upon which the processorcore 601 is disposed is at the far end of the bus 620 or if it isinternal to the bus 620. In addition, like the LMC logic 503 of FIG. 5,the LMCP logic 613 senses the value of signal SIGLOC 1 to determine ifPAD1 is at the far end of the bus 620, as described above with referenceto FIG. 5, or if it is internal to the bus 620.

The values of signals SIGLOC 1-SIGLOC N generated by the location array610 according to the embodiment of FIG. 6 may indicate that acorresponding signal output signal (e.g., PAD1) is at the end of the bus620, but this indication is only as is known from the perspective of theparticular substrate upon which the location array 610 is disposed.Consequently, if the state of MPK indicates that the package upon whichthe processor core 601 is disposed is at the far end of the bus 620,then operation of each of the drivers 611 within the core 601 isidentical to the embodiment discussed with reference to FIG. 5.

If, however, the state of MPK indicates that the package upon which theprocessor core 601 is disposed is internal to the bus 620, then signalENPU is deasserted by the LMCP logic 613, signal ENPD2 is asserted, andsignal PAD1 is thus controlled via the first and second pull-down logic607-608, operating in parallel. The pull-up logic 605 is disabled by thestate of signal PUEN1 in an internal package configuration, as indicatedby the value of signal MPK on node P 602.

To summarize, if the states of MPK and SIGLOC 1 both indicate that acorresponding signal PAD1 is at the end of the bus 620, then the LMCPlogic 613 enables the pull-up logic 605 when the bus 620 is not beingdriven (i.e., the state of PAD1 is at the high voltage level VH). Whenthe bus 620 is being driven to assert a low voltage level VL, then theLMCP logic 613 turns off the pull-up logic 605, and drives PAD1 usingonly first pull-down logic 607. On the other hand, if the state of MPKindicate that PAD 1 is internal to bus 620, then the LMCP logic 613disables the pull-up logic 605 when the bus 620 is not being driven. Andwhen the bus 620 is being driven to assert a low voltage level VL, thenthe LMCP logic 613 keeps the pull-up logic 605 turned off, and drivesPAD1 using both the first pull-down logic 607 and the second pull-downlogic 608.

The embodiments discussed with reference to FIGS. 5-6 employ a techniquewhereby the physical location in terms of trace length (FIG. 5), ortrace length and motherboard position (FIG. 6), are used to designate asignal and its corresponding driver as being at the end of the bus orinternal to the bus. This is because proper bus termination must beprovided at both ends of the bus, that is, the end upon which thechipset is disposed and the end upon which the multi-core substratefarthest from the chipset is disposed. Proper termination is necessaryat the chipset end of the bus to provide for signals that are driven bya processor core (i.e., writes). Proper termination is required at theprocessor end of the bus to provide for signals that are driven by thechipset (i.e., reads). A driver that is designated as being at the endof the bus must keep its pull-up logic enabled when not driving the bus(to provide for bus reads) and a driver that is internal to the bus mustkeep its pull-up logic disabled when not driving the bus. During buswrites, both internal and external drivers must turn off theirrespective pull-up logic when driving low for the termination impedanceis generated at the other end of the bus by the chipset. Far end driversemploy only first pull-down logic to drive low and internal driversemploy both first and second pull-down logic.

The present inventors have also observed that for many signals andsignal groups such as address, data, and control busses, as is notedabove, specific bus protocols provide rules and corresponding protocolsignals that are employed to determine exclusive access (or “ownership”)of a given bus by a given processor core. That is, based upon aknowledge of previous events that have occurred on a given bus alongwith the current states of certain ones of the protocol signals, all ofthe processor cores coupled to the bus can determine which one of theprocessor cores has exclusive ownership of the bus. It is beyond thescope of the present application to provide a detailed discussion ofparticular bus protocols, however, one skilled in the art willappreciate that virtually all present day system busses provide aprotocol that specifies rules and corresponding protocol signals bywhich a given processor core can determine whether or not it “owns” thebus for purposes of reading or writing data that is associated with oneor more groups of signals. Hence, to provide for active terminationcontrol in a multi-core/multi-package configuration having groups ofsignals that are ruled according to one or more bus protocols by whichexclusive ownership of the bus can be determined, an embodiment of thepresent invention will now be discussed with reference to FIG. 7.

FIG. 7 is a block diagram 700 featuring a protocol-based multi-core bustermination apparatus according to the present invention which may beemployed in a configuration having one or more multi-core packagescoupled to a bus. The apparatus may be employed when two or moremulti-core processors (not shown), such as the multi-core processor 400of FIG. 4, are coupled to a plurality of protocol-based bussed signalsdisposed on a motherboard (not shown) or like device in a configurationlike that shown in FIG. 2. For purposes of the present application, theterm “protocol-based bussed signals” is employed to mean one or moregroups of signals that are ruled according to one or more bus protocolsby which exclusive ownership of the bus can be determined.

The block diagram 700 depicts one of the processor cores 701 that iscoupled to a substrate (not shown) for the multi-core processor. Theelements of core 701 are substantially the same and operate insubstantially the same manner as those like numbered elements of FIG. 6,where a “7” is substituted for the hundreds digit. To provide for properbus terminations as can be determined by knowledge of previous eventsthat have occurred on a given bus along with the current states ofprotocol signals 731, protocol-based multi-core logic (“PMC”) 723 isprovided in place of the LMCP logic 613 of FIG. 6.

The block diagram 700 also shows a protocol analyzer 730 that is coupledto one or more protocol signals PROTOCOL 731. The protocol analyzer 730develops a signal BUSOWN whose state indicates whether or not theprocessor core 701 owns the protocol-based bus for purposes oftransferring information. Signal BUSOWN is coupled to each of aplurality of substantially identical drivers 711 that develop signalswithin a signal group which are governed by the one or more busprotocols.

In operation, the protocol analyzer 730 determines ownership of theprotocol-based bus based upon knowledge of previous events that haveoccurred on the protocol-based bus along with the current states of theprotocol signals 731. If the core 701 owns the protocol-based bus, thenthe protocol analyzer 730 asserts BUSOWN. If the core 701 does not ownthe protocol-based bus, then the protocol analyzer 730 does not assertBUSOWN.

It is noted that since ownership of the protocol-based bus is exclusive,only one processor core 701 in a multi-core/multi-package configurationwill have signal BUSOWN asserted. All the remaining cores 701 will notassert their corresponding BUSOWN signals.

Accordingly, the PMC logic 723 in each senses the state of signal BUSOWNto determine whether or not the processor core 701 owns theprotocol-based bus. If the core 701 does not own the protocol-based bus,then the PMC logic 723 deasserts signal ENPU, thus turning off thepull-up logic 705. If the core 701 owns the protocol-based bus, then thePMC logic 723 asserts signal ENPU, thus turning on the pull-up logic705. Hence, pull-up logic 705 is turned on in all of the drivers 711 foronly one of the cores 701 that are coupled to a protocol-based bus atany given point in time; the remaining cores 701 on the protocol-basedbus have pull-up logic 705 that is turned off.

As a result, the “end of the bus” for a group or groups of signals, asis exemplified by signal PAD1, is dynamically determined and controlled.And since all other cores 701 have their pull-up logic 705 turned off,the topology of the protocol-based bus at any point in time is apoint-to-point topology. That is, there is only one core 701 thatprovides active termination control; all the other cores 701—thoughcoupled to the protocol-based bus—do not provide any active terminationcontrol features. The “end of the bus” always moves to the core 701 thatowns the bus at a particular point in time and as a result there are no“internal” bus devices.

The protocol analyzer 730 and PMC logic 723 each comprise logic,circuits, devices, or microcode (i.e., micro instructions or nativeinstructions), or a combination of logic, circuits, devices, ormicrocode, or equivalent elements that are employed to perform functionsand operations as described herein. The elements employed to performthese functions and operations may be shared with other circuits,microcode, etc., that are employed to perform other functions within theprocessor core 701.

If the state of BUSOWN is not asserted, then the PMC logic 723 turns offthe pull-up logic 705. Since the core 701 does not own theprotocol-based bus, it will not be driving signal PAD1 nor will it bedirectly communicating with the chipset.

If the state of BUSOWN is asserted, then the PMC logic 723 turns on thepull-up logic 705 when the bus 720 is not being driven (i.e., the stateof PAD1 is at the high voltage level VH). When the bus 720 is beingdriven to assert a low voltage level VL, then the PMC logic 723 turnsoff the pull-up logic 705, and drives PAD1 using only first pull-downlogic 607.

An alternative embodiment contemplates a driver 711 having only firstpull-down logic 707, since second pull-down logic 708 is never employedwhen protocol-based termination is practiced.

The present inventors realized that there are many applications wheresystem configurations are provided that require the use of bothprotocol-based busses and bussed signals that are not governed byprotocol. To address these types of configurations, an embodiment of thepresent invention will now be discussed with reference to FIG. 8.

FIG. 8 is a block diagram 800 showing a configurable multi-core bustermination mechanism according to the present invention. The apparatusmay be employed when one or more multi-core processors (not shown), suchas the multi-core processor 400 of FIG. 4, are coupled to one or moreprotocol-based bussed signals and one or more location-based bussedsignals disposed on a motherboard (not shown) or like device in aconfiguration like that shown in FIG. 2. For purposes of the presentapplication, the term “location-based bussed signals” is employed tomean one or more signals that are not ruled according to one or more busprotocols by which exclusive ownership of the bus can be determined.That is, location-based bussed signals fall into the category of thosebussed signals which are discussed above with reference to FIGS. 4-6.For example, control signals that couple a microprocessor to/from avoltage regulator module (VRM) may be considered as one example of a setof location-based bussed signals.

The block diagram 800 depicts one of the processor cores 801 that iscoupled to a substrate (not shown) for the multi-core processor. Theelements of core 801 are substantially the same and operate insubstantially the same manner as those like numbered elements of FIG. 7,where an “8” is substituted for the hundreds digit. In addition, thecore 801 includes a location array 810 developing location signalsSIGLOC 1-SIGLOC N, and which are substantially the same in embodimentand operation as the location array 510 of FIG. 5. The processor core801 also includes a signal MPK that is coupled to a multi-package node P802, both of which are substantially the same in embodiment andoperation as signal MPK and node P 602 of FIG. 6. Furthermore, the core801 includes a protocol analyzer 830 coupled to a protocol control bus831 and developing a bus ownership signal BUSOWN, all of which aresubstantially the same in embodiment and operation as the like-namedelements of FIG. 7.

The core 801 has a driver configuration array 840 developing acorresponding plurality of location/protocol signals L/P 1-L/P N, eachof which is coupled to a corresponding one of the drivers 811. Each ofthe drivers 811 include configurable multi-core/multi-package (“CMCMP”)logic 843, to which is coupled a corresponding location signal SIGLOC1-SIGLOC N, signal MPK, and signal BUSOWN. The driver configurationarray 840 and CMCMP logic 833 comprise logic, circuits, devices, ormicrocode (i.e., micro instructions or native instructions), or acombination of logic, circuits, devices, or microcode, or equivalentelements that are employed to perform functions and operations asdescribed herein. The elements employed to perform these functions andoperations may be shared with other circuits, microcode, etc., that areemployed to perform other functions within the processor core 801.

A corresponding location/protocol signal L/P1 is coupled to the CMCMPlogic 843 and to the configuration array 840. In one embodiment, theconfiguration array 840 comprises a programmable fuse array 840 that isdisposed within the core 801 and which is programmed during fabricationof the processor core 801 by any of several well-known techniques. Inanother embodiment, the configuration array 840 comprises a machinespecific register that is programmable via the execution of specialinstructions (i.e., microcode) during reset of the core 801.

The value of signal L/P 1 indicates whether its corresponding driverDRIVER 1 811 is to employ location-based bus termination orprotocol-based bus termination, the two techniques having been describedabove with reference to FIGS. 5-7. If the state of L/P 1 indicates thatlocation-based termination is to be employed, then the CMCMP logic 843controls the pull-up logic 805, first pull-down logic 807, and secondpull-down logic 808 as is described above with reference to FIGS. 5-6.That is, bus location (i.e., end or internal) is determined by thestates of signals MPK (for multi-package configurations) and SIGLOC 1.If the state of L/P 1 indicates that protocol-based termination is to beemployed, then the CMCMP logic 843 controls the pull-up logic 805, firstpull-down logic 807, and second pull-down logic 808 as is describedabove with reference to FIG. 8. That is, termination for a given outputPAD1 is based upon whether or not the core 801 owns the bus, as isindicated by signal BUSOWN.

As noted herein, the mechanism according to the present inventionprovides the advantageous characteristics of an actively terminated buswhile also providing an environment for multiple cores within a package,multiple multi-core package configurations, and options to provide fortermination based on location and/or protocol.

Although the present invention and its objects, features, and advantageshave been described in detail, other embodiments are encompassed by theinvention as well. For example, the present invention has been presentedin terms related to a processor and memory controller (or substantiallysimilar device). It is noted, however, that such examples are used toteach the present invention in a context that is familiar to many ofthose in the art. But the present inventors note that bus protocols andtransmission line interface requirements are not specific or unique tothe processor arts and as such, the present invention lends itself toapplication in any area where a bus interface having active impedancecontrol requirements is specified.

In addition, the present invention has been described herein withreference to first and second pull-down logic, which operate in aninternal processor in parallel to pull-down a bus that is activelyterminated at both ends by other devices, the scope of the presentinvention is not restricted to two sets of pull-down logic equallyconfigured. An alternative embodiment also contemplates a configurationwhere a second pull-down logic is employed exclusive of a firstpull-down logic to pull down a bus voltage from a device that isinternal to the bus. In one embodiment, the second pull-down logic isconfigured to pull down the bus voltage to a proper voltage levelexclusive of any other device.

Those skilled in the art should appreciate that they can readily use thedisclosed conception and specific embodiments as a basis for designingor modifying other structures for carrying out the same purposes of thepresent invention, and that various changes, substitutions andalterations can be made herein without departing from the scope of theinvention as defined by the appended claims.

1. An apparatus for enabling a multi-core/multi-package environment on abus, the bus requiring active termination impedance control, theapparatus comprising: a configuration array, disposed within saidprocessor core and configured to generate a plurality oflocation/protocol signals that each direct one of a correspondingplurality of drivers on the bus to employ location-based bus terminationor protocol-based bus termination, wherein said processor core isdisposed on a multi-core substrate; and said corresponding plurality ofdrivers, coupled to said plurality of location/protocol signals, aplurality of location signals, a bus ownership signal, and amulti-package signal, each of said corresponding plurality of driversconfigured to control how one of a corresponding plurality of nodes isdriven responsive to a first state of a corresponding one of saidplurality of location/protocol signals, said each of said correspondingplurality of drivers comprising: configurable multi-core/multi-packagelogic, configured control pull-up logic, first pull-down logic, andsecond pull-down logic according to location-based termination rules ifsaid first state indicates said location-based termination, andconfigured control said pull-up logic, said first pull-down logic, andsaid second pull-down logic according to protocol-based terminationrules if said first state indicates said protocol-based termination. 2.The apparatus as recited in claim 1, wherein said location-based rulesdirect said configurable multi-core/multi-package logic to enable saidpull-up logic and said first pull-down logic if a second state of acorresponding one of said plurality of location signals indicates a busend location, and to disable said pull-up logic and enable said firstpull-down logic and said second pull-down logic if said second stateindicates an internal location.
 3. The apparatus as recited in claim 1,wherein said location-based rules direct said configurablemulti-core/multi-package logic to enable said pull-up logic and saidfirst pull-down logic if a second state of a corresponding one of saidplurality of location signals indicates a bus end location and a thirdstate of said multi-package signal indicates that said multi-coresubstrate is at a far end of the bus, and to disable said pull-up logicand enable said first pull-down logic and said second pull-down logic ifsaid second state indicates an internal location and said third stateindicates that said multi-core substrate is at said far end, and todisable said pull-up logic and enable said first pull-down logic andsaid second pull-down logic if said third state indicates that saidmulti-core substrate is internal to the bus.
 4. The apparatus as recitedin claim 1, wherein said protocol-based rules direct said configurablemulti-core/multi-package logic to enable said pull-up logic if said busownership signal indicates that said processor core owns the bus, andconfigured to disable said pull-up logic if said bus ownership signalindicates that said processor core does not own the bus.
 5. Theapparatus as recited in claim 1, wherein said configurablemulti-core/multi-package logic comprises a plurality of fuses disposedon one or more layers of a die corresponding to said processor core. 6.The apparatus as recited in claim 5, wherein said plurality of fuses isprogrammed during fabrication of said processor core.
 7. The apparatusas recited in claim 1, wherein said configurablemulti-core/multi-package logic comprises a machine specific register,and wherein contents of said machine specific register are programmedvia execution of instructions during reset of said processor core. 8.The apparatus as recited in claim 1, wherein said processor core iscoupled to said multi-core substrate in a multi-core processorconfiguration.
 9. The apparatus as recited in claim 8, wherein saidmulti-core processor is coupled to a chipset via the bus and to one ormore other multi-core processors via the bus.
 10. The apparatus asrecited in claim 1, wherein said pull-up logic, when enabled, generatesa termination impedance as specified for the bus, and wherein saidtermination impedance is generated to match a characteristic impedanceof the bus.
 11. The apparatus as recited in claim 1, wherein saidpull-up logic, when enabled, generates a termination impedance asspecified for the bus, and wherein said termination impedance isgenerated to match a characteristic impedance of the bus.
 12. Anapparatus providing for a multi-core/multi-package environment on a bus,where the bus requires active termination impedance control, theapparatus comprising: configurable multi-core/multi-package logic,disposed within one of a plurality of drivers, coupled to one of acorresponding plurality of location/protocol signals, one of acorresponding plurality of location signals, a bus ownership signal, anda multi-package signal, and configured to control pull-up logic, firstpull-down logic, and second pull-down logic according to a first stateof said one of a corresponding plurality of location/protocol signals;and a configuration array, disposed within a processor core and coupledto said configurable multi-core/multi-package logic, configured togenerate said corresponding plurality of location/protocol signals thateach direct a corresponding one of said plurality of drivers to employlocation-based bus termination rules or protocol-based bus terminationrules, wherein said processor core is disposed on a multi-coresubstrate.
 13. The apparatus as recited in claim 12, wherein saidlocation-based bus termination rules direct said configurablemulti-core/multi-package logic to enable said pull-up logic and saidfirst pull-down logic if a second state of said one of a correspondingplurality of location signals indicates a bus end location, and todisable said pull-up logic and enable said first pull-down logic andsaid second pull-down logic if said second state indicates an internallocation.
 14. The apparatus as recited in claim 12, wherein saidlocation-based bus termination rules direct said configurablemulti-core/multi-package logic to enable said pull-up logic and saidfirst pull-down logic if a second state of said one of a correspondingplurality of location signals indicates a bus end location and a thirdstate of said multi-package signal indicates that said a multi-coresubstrate is at a far end of the bus, and to disable said pull-up logicand enable said first pull-down logic and said second pull-down logic ifsaid second state indicates an internal location and said third stateindicates that said multi-core substrate is at said far end, and todisable said pull-up logic and enable said first pull-down logic andsaid second pull-down logic if said third state indicates that saidmulti-core substrate is internal to the bus.
 15. The apparatus asrecited in claim 12, wherein said protocol-based bus termination rulesdirect said configurable multi-core/multi-package logic to enable saidpull-up logic if said bus ownership signal indicates that said processorcore owns the bus, and configured to disable said pull-up logic if saidbus ownership signal indicates that said processor core does not own thebus.
 16. The apparatus as recited in claim 12, wherein said configurablemulti-core/multi-package logic comprises a plurality of fuses disposedon one or more layers of a die corresponding to said processor core. 17.The apparatus as recited in claim 16, wherein said plurality of fuses isprogrammed during fabrication of said processor core.
 18. The apparatusas recited in claim 12, wherein said configurablemulti-core/multi-package logic comprises a machine specific register,and wherein contents of said machine specific register are programmedvia execution of instructions during reset of said processor core. 19.The apparatus as recited in claim 12, wherein said processor core iscoupled to said multi-core substrate in a multi-core processorconfiguration.
 20. A method for enabling a multi-core/multi-packageenvironment on a bus, the bus requiring active termination impedancecontrol, the method comprising: via a configuration array disposedwithin a processor core, generating a first indication designating howone of a plurality of nodes to be driven, wherein the processor core isdisposed on a multi-core substrate; and via configurable multi-corelogic disposed within a driver, controlling how the one of a pluralityof nodes is driven, said controlling comprising: if the first indicationdesignates the one of the plurality of nodes is to be driven accordingto location-based termination rules, enabling pull-up logic, firstpull-down logic, and second pull-down logic in accordance with secondstate of one of a plurality of location signals and the third state of amulti-package signal; and if the first indication designates the one ofthe plurality of nodes is to be driven according to protocol-basedtermination rules, enabling the pull-up logic, first pull-down logic,and second pull-down logic in accordance with the fourth state of a busownership signal.
 21. The method as recited in claim 20, wherein thelocation-based rules direct the configurable multi-core/multi-packagelogic to enable the pull-up logic and the first pull-down logic if thesecond state indicates a bus end location, and to disable the pull-uplogic and enable the first pull-down logic and the second pull-downlogic if the second state indicates an internal location.
 22. The methodas recited in claim 20, wherein the location-based rules direct theconfigurable multi-core/multi-package logic to enable the pull-up logicand the first pull-down logic if the second state indicates a bus endlocation and the third state indicates that the multi-core substrate isat a far end of the bus, and to disable the pull-up logic and enable thefirst pull-down logic and the second pull-down logic if the second stateindicates an internal location and the third state indicates that themulti-core substrate is at the far end, and to disable the pull-up logicand enable the first pull-down logic and the second pull-down logic ifthe third state indicates that the multi-core substrate is internal tothe bus.
 23. The method as recited in claim 20, wherein theprotocol-based rules direct the configurable multi-core/multi-packagelogic to enable the pull-up logic if the fourth state indicates that theprocessor core owns the bus, and configured to disable the pull-up logicif the bus ownership signal indicates that the processor core does notown the bus.
 24. The method as recited in claim 20, wherein the pull-uplogic, when enabled, generates a termination impedance as specified forthe bus, and wherein the termination impedance is generated to match acharacteristic impedance of the bus.